- FPC / flexible circuit board production process (opening and drilling)
- Update：2019/1/16 17:21:23
- Knowledge of raw material coding
NDIR050513HJY: D→double-sided, R→ rolled copper, 05→PI thickness 0.5mil, ie 12.5um, 05→copper thickness 18um, 13→glue layer thickness 13um.
XSIE101020TLC: S→ single side, E→electrolytic copper, 10→PI thickness 25um, 10→copper thickness 35um, 20→glue thickness 20um.
CI0512NL: (cover film): 05 → PI thickness 12.5um, 12 → glue thickness 12.5um. Total thickness: 25um.
Process quality control
A. The operator should wear gloves and finger cots to prevent the surface of the copper foil from oxidizing due to contact with sweat on the hands.
B. The correct way of stacking to prevent wrinkles.
C. Can not be cut, the hand can not damage the punching positioning hole and test hole.
D. Material quality, the surface of the material shall not have wrinkles, stains, heavy oxidation, and the cut material shall not have burrs or spills.
Contact us
- Dongguan Siho Electronics Co., Ltd.
- Contact： Mr. Pan
- Telephone： 0769-86475579-809
- Mobile： 13602319220/68721220
- E-mail：pan@sihopcb.com
- Address： No. 18, linhai road, fenghuangshan industrial zone, shajiao, humen town, dongguan city
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