1, production specifications
*Minimum wire diameter / line spacing: 0.076mm
* Computer drilling minimum aperture: 0.2mm
* Solder mask: butter, white oil, black oil
1 UV green oil s/m
2 thermosetting green oil s/m
3 photosensitive green oil s/m
* Shape processing
Steel die cutting
*Maximum production area: 650mm*650mm
*plating
Light copper, nickel plating, immersion gold, gold plating, tin plating
* Plate thickness: 0.05-1.2mm
* Layers 1-10 layers
*Basic copper foil thickness: 18, 35, 70um

2, flexible circuit board FPC
[Main performance]
Polyimide
*280° solder resistance is greater than 10 seconds
* Anti-stripping strength is greater than 1.2 kg / cm
* Surface resistance is not less than 1.0*1.0 ohms
*Resistance is in compliance with IPC
*Chemical resistance in line with IPC
Polyester
* Anti-stripping strength is greater than 1.2 kg / cm
* Surface resistance is not less than 1.0*1.0 ohms
*Resistance is in compliance with IPC
*Chemical resistance in line with IPC

[Specifications]
Polyimide
Film thickness: 0.0125-0.1 mm
Copper foil: electrolytic copper, rolled copper
Copper foil thickness: 0.009, 0.018, 0.035,
0.070, 0.10 mm
Polyester
Film thickness: 0.0125-0.1 mm
Copper foil: electrolytic copper, rolled copper
Copper foil thickness: 0.009, 0.018, 0.035,
0.070, 0.10 mm