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project
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Processing capacity
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最大拼版尺寸 max panel size
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28 ＂ x21＂（L4 --- L8）
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38 ＂ x22＂（L1 --- L2）
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内层最小线宽 / 线距
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0.075mm /0.075mm
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innerlayer line width/space(min)
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（ 75um/75um ）
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最小内层隔离环宽
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0.15mm
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min innerlayer clearance
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最小内层焊盘
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0.1 --- 0.15mm
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min innerlayer pad
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最薄内层厚度
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0.075mm
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min core thickness
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最小绝缘层厚度
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0.076mm
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min dielectric thickness
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内层铜箔厚度
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1/3oz -----3oz
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thickness of inner copper
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外层底铜厚度
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1/3oz ----- 3oz
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thickness of outerlayer base copper
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完成板厚度
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0.20 --- 6.5mm
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thickness of finished panel
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完成板厚度公差
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板厚＜ 1.0mm
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±12 ％
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tolerance of
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1.0mm≤ 板厚＜ 2.0mm
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±8 ％
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finished panel thickness
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板厚 ≥2.0mm
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±10 ％
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内层表面处理工艺
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黑 / 棕氧化
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surface treating technic of innerlayer
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层数 layer number
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1 ～ 8
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多层板层间对准度
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±0.076mm (±3mil)
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registration of innerlayer to innerlayer
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最小钻孔孔径
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0.25mm
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min drilling diameter
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最小完成孔径
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0.20mm
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min diameter of finished hole
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孔位精度
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±0.05mm （ ±2mil ）
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accuracy of hole position
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槽孔公差
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±0.10mm （ ±4mil ）
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tolerance of drilled slot
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镀通孔孔径公差
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±0.075mm （±3mil） ,极限±0.05mm （±2mil）
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tolerance of PTH diameter
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非镀通孔孔径公差
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± 0.025mm（±1mil)
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tolerance of NPTH diameter
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