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FPC / flexible circuit board production process (plating articles)
Update：2019/1/16 17:20:50
plating

Principle and function of PTH: PTH is a redox reaction of auto-catalyzing (palladium and copper atoms as a catalyst) in the plating solution without external current, so that copper ions are deposited on the activated pore wall and copper foil surface. The process, also known as electroless copper or autocatalytic copper plating.

PHT process: Alkali degreasing→water washing→micro-etching→water washing→water washing→pre-dip→activation→water washing→water washing→speeding→water washing→water washing→chemical copper→water washing.

Treatment of common adverse conditions of PTH

No copper in the hole: a activated palladium adsorption deposition is not good. b speeding tank: the speed of the accelerator is not right. c chemical copper: the temperature is too low, so the reaction can not be carried out too slow; the bath composition is wrong.

There are particles in the hole wall, rough: a chemical groove has particles, copper powder is unevenly deposited, filter is opened by the filter. b plate itself has burrs on the hole wall.

The surface of the board is black: a chemical tank is not the right component (NaOH concentration is too high).

Copper-plated copper plating improves the uniformity of the coating in the hole, ensuring that the coating thickness of the entire plate (the entire coating in the hole and near the hole) meets certain requirements.

Plating condition control

a choice of current density

b plating area size

c coating thickness requirements

d plating time control

Quality control 1 Throughability: self-test QC full inspection, check the hole wall with 40 times magnifying glass to see if there is copper plating completely attached.