- FPC / Flexible Circuit Board Production Process (General Process)
- Update:2019/1/16 17:21:40
- Double panel process:
Unloading → Drilling → PTH → Plating → Pre-treatment → Dry film → Alignment → Exposure → Development → Pattern plating → Stripping → Pre-treatment → Sticking dry film → Registration exposure → Development → Etching → Stripping → Surface treatment → Cover film → Press → Curing → Nickel gold → Print characters → Cut → Electrical test → Punching → Final inspection → Packaging → Shipping
Single panel process:
Unloading → Drilling → Drying film → Alignment → Exposure → Development → Etching → Stripping → Surface treatment → Cover film → Pressing → Curing → Surface treatment → Nickel gold → Printed characters → Shear → Electrical test → Punching Cut → final inspection → packaging → shipping